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12000 F2001 ISL62 58X25 P72804S2 25LC0 100FC 200CA
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  general features v ds =60v,i d =4.5a r ds(on) < 45m ? @ v gs =10v typ 38m ? high density cell design for ultra low rdson fully characterized avalanche voltage and current low gate to drain charge to reduce switching losses application power switching application hard switched and high frequency circuits uninterruptible power supply schematic diagram marking and pin assignment sop-8 top view package marking and ordering information device marking device device package reel size tape width quantity MSC0605W sop-8 ?330mm 12mm 2500 units absolute maximum ratings (t a =25 unless otherwise noted) parameter symbol limit unit drain-source voltage v ds 60 v gate-source voltage v gs 20 v drain current-continuous i d 4.5 a drain current-continuous(t c =100 ) i d (100 ) 3.0 a pulsed drain current i dm 20 a maximum power dissipation p d 2 w operating junction and st orage temperature range t j ,t stg -55 to 150 thermal characteristic thermal resistance,junction-to-ambient (note 2) r ja 62.5 /w MSC0605W MSC0605W 60v(d-s) dual n-channel enhancement mode power mos fet lead free pin configuration more semiconductor company limited http://www.moresemi.com 1/6
electrical characteristics (t a =25 unless otherwise noted) parameter symbol condition min typ max unit off characteristics drain-source breakdown voltage bv dss v gs =0v i d =250 a 60 69 - v zero gate voltage drain current i dss v ds =60v,v gs =0v - - 1 a gate-body leakage current i gss v gs =20v,v ds =0v - - 100 na on characteristics (note 3) gate threshold voltage v gs(th) v ds =v gs ,i d =250 a 1.2 2.0 2.5 v drain-source on-state resistance r ds(on) v gs =10v, i d =4.5a 38 45 forward transconductance g fs v ds =5v,i d =4.5a 11 - - s dynamic characteristics (note4) input capacitance c lss 450 pf output capacitance c oss 60 pf reverse transfer capacitance c rss v ds =25v,v gs =0v, f=1.0mhz 25 pf switching characteristics (note 4) turn-on delay time t d(on) - 4.7 - ns turn-on rise time t r - 2.3 - ns turn-off delay time t d(off) - 15.7 - ns turn-off fall time t f v ds =30v,i d =4.5a v gs =10v,r gen =3 ? - 1.9 - ns total gate charge q g - 8.5 - nc gate-source charge q gs - 1.6 - nc gate-drain charge q gd v ds =30v,i d =4.5a, v gs =10v - 2.2 - nc drain-source diode characteristics diode forward voltage (note 3) v sd v gs =0v,i s =4.5a - - 1.2 v diode forward current (note 2) i s - - 4.5 a reverse recovery time t rr - 25 - ns reverse recovery charge qrr tj = 25c, i f =4.5a di/dt = 100a/ s (note3) - 35 - nc forward turn-on time t on intrinsic turn-on time is negligible (turn-on is dominated by ls+ld) notes: 1. repetitive rating: pulse width limited by maximum junction temperature. 2. surface mounted on fr4 board, t 10 sec. 3. pulse test: pulse width 300 s, duty cycle 2%. 4. guaranteed by design, not subject to production more semiconductor company limited http://www.moresemi.com 2/6 MSC0605W
test circuit 1) e as test circuits 2) gate charge test circuit 3) switch time test circuit more semiconductor company limited http://www.moresemi.com 3/6 MSC0605W
typical electrical and the rmal characteristics (curves) vds drain-source voltage (v) figure 1 output characteristics vgs gate-source voltage (v) figure 2 transfer characteristics i d - drain current (a) figure 3 rdson- drain current t j -junction temperature( ) figure 4 rdson-junctiontemperature qg gate charge (nc) figure 5 gate charge vsd source-drain voltage (v) figure 6 source- drain diode forward rdson on-resistance ( m ? ) i d - drain current (a) i d - drain current (a) normalized on-resistance vgs gate-source voltage (v) i s - reverse drain current (a) more semiconductor company limited http://www.moresemi.com 4/6 MSC0605W
vds drain-source voltage (v) figure 7 capacitance vs vds vds drain-source voltage (v) figure 8 safe operation area t j -junction temperature( ) figure 9 bv dss vs junction temperature t j -junction temperature( ) figure 10 v gs(th) vs junction temperature i d - drain current (a) c capacitance (pf) square wave pluse duration(sec) figure 11 normalized maximum transient thermal impedance r(t),normalized effective transient thermal impedance normalized bvdss vth (v) variance more semiconductor company limited http://www.moresemi.com 5/6 MSC0605W
sop-8 package information dimensions in millimeters dimensions in inches symbol min. max. min. max. a 1.350 1.750 0.053 0.069 a1 0.100 0.250 0.004 0.010 a2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 d 4.700 5.100 0.185 0.200 e 3.800 4.000 0.150 0.157 e1 5.800 6.200 0.228 0.244 e 1.270(bsc) 0.050(bsc) l 0.400 1.270 0.016 0.050 0 8 0 8 more semiconductor company limited http://www.moresemi.com 6/6 MSC0605W


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